Interconnect Modeling and Analysis in the Nanometer Era: Cu and Beyond
نویسندگان
چکیده
This paper highlights key emerging issues in the domain of interconnect modeling and analysis. The implications of various nanoscale effects on VLSI interconnect performance, reliability, power dissipation and parasitic extraction are also presented. Finally, promising new technologies are outlined which have the potential to meet these interconnect challenges in the nanometer era.
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